Today many terminations cannot be soldered.........period.
But I still am infatuated with marrying copper atoms with tin and lead atoms. Copper and oxygen don't get along too well. I figure you can compress a terminal so tight it can catch fire and it's still going to be bathed in oxygen. That interface is not protected. An extremely high percentage CU colloidal compound is better than bare squeezed copper.
When I was rebuilding and used press-fit rectifiers, I found out using thermography verification that using zinc oxide paste reduced diode case temperature noticeably. If it reduces case temperature it reduces junction temperature.
A synthetic base 95% CU colloidal compound has its uses.