for close spacing soldering a "new" techinque was developed decades ago. We used it in reworking IC's. We had deviced with leads on 10 mil centers. Use a hot air gun to remove the device. Dispense strip of solder paste using a sirenge, place the part reasonably accurate on the pads. Use the heat gun to melt the solder, the device will center itself, solder will wick up and not bridge any pads.
Hot air soldering station systems are readily available for the kind of rework you are looking at. Much better than ever trying to solder individual leads.